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HFP Series

FIBRE GLASS SUBSTRATE
SILICONE COATED WIRE WOUND
RESISTORS
DIRECT SNAP ON PCB MOUNTING
  • Choice of two terminals stand-off heights which are suitable for wave soldering
  • TCR as low as ± 200ppm/°C available

APPLICABLE STANDARDS - IS - 8909 and IEC 266

Physical configuration

 

CHOICE OF TERMINALS

 

HTR TYPE POWER RATING at 70°C DIMENSIONS (mm) RESISTANCE RANGE Wt Per PC '0' Terminal Wt Per PC '1' Terminal
L
+2/-1 		D
±1 		P
+2/-1 		MIN MAX
F-2P 2W 18.2 5.0 10.2 R10 2K0 1.38 1.05
F-4P 4W 23.3 5.0 15.2 R38 3K0 1.70 1.25
F-5P 5W 33.4 5.0 25.4 R63 5K0 2.10 1.90
F-7P 6.5W 43.5 5.0 35.4 R87 7K0 2.80 2.50
F-8P 8W 53.7 5.0 45.7 1R0 9K0 3.10 2.91

Choice of Terminals

Resistors with resistance value higher than the given range is possible using ceramic substrates

Electrical and Environmental Characteristics / Data

Test Performance Requirements
Resistance tolerance ± 10% [K] ± 5%[J]
[< 1Ohm + 0.05Ohm]
Rated ambient temperature
[See derating curve]		 at 70°C full power dissipation
Temperature co-efficient ±200 ppm/°C [>10 Ohm]
±450 ppm/°C [<10 Ohm]
±600 ppm/°C [<1 Ohm]
Short time overload Max D R± [2% +0.05Ohm]
Moisture Resistance Max D R±[5% +0.05Ohm]
Load Life Max D R± [5% +0.05Ohm]
Ambient operating temperature range -25°C to +155°C
Derating Curve

Temperature Rise

(1) Body Temperature measuring point

(2)Solder joint measuring point
TYPE TEMPERATURE AT FULL POWER DISSIPATION
MEASURING POINT 1 MEASURING POINT 2
HIGH RESISTANCE
RANGE		 LOW RESISTANCE
RANGE		 'O' TYPE
TERMINAL		 'I' TYPE
TERMINAL
F2P 230°C 180°C 50°C 70°C
F4P 285°C 235°C 83°C 98°C
F5P 285°C 240°C 50°C 85°C
F7P 292°C 260°C 45°C 85°C
F8P 290°C 246°C 55°C 80°C

 

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