AEM Statement of Qualifications

Ferrite/Ceramic Power Beads, Chip Beads & Inductors

Power beads

POWER BEADS available in EIA & JIA sizes:0805(2012), 1206(3216) & 1806(4516) currents of .5 to 3 Amps

CHIP BEADS available in EIA & JIA sizes: 0603(1608), 0805(2012) & 1206(3216) from 30 to 3000 ohms & 1806(4516) from 60 to 3500 ohms
INDUCTORS available in EIA & JIA sizes: 0603(1608), 0805(2012) & 1206(3216) from 0.047 to 5.6 mH

CURRENT LIMITING FUSE MODELS AVAILABLE:

P600L, LEADED - QPL (Fast Acting) RATINGS:72V from 1/8TO 15 AMPS 125 V from I /8 TO 5 AMPS & 50 V at 20 AMPS
P700L, SURFACE MOUNT (Fast Acting; RATINGS: 72 V from I /8 TO 15 AMPS & 50 V at 20 AMPS
P800L LEADED - SLOW-BLOW RATINGS: 72 V @ 2 TO 15 AMPS

BEAD/INDUCTOR APPLICATIONS
To suppress EMI/RFI and to prevent self-oscillation inelectronic products such as

FEATURES

Designed to reduce noise above the operating frequencies.
Standard EIA and EW chip sizes such as 0603, 0805, 1206, and 1806
A complete set of ferrites/ceramic and electrode materials provide a wide range of electrical properties.
Superior termination bonding strength per EIA & JIA
Nickel barrier, with solder over coated termination offers excellent solderability and solder leach resistance per EIA & JIA. Suitable for both wave and reflow solder processes.

FUSE APPLICATIONS
Used in military & commercial satellites and manned space vehicles

FEATURES

Consistent clear-times at overload currents regardless of vacuum conditions
Solid Body construction does not out-gas and therefore is not subject to the aerating factors of Mil Std-975
Solid Body construction can withstand greater vibration and shock exposure without damage
Positive temperature coefficient of fuse element causes resistance to increase (prior to opening) thereby preventing absolute shorts to the power source
Internal construction assures that arc, plasma, and vapor are contained within the fuse package during overload current conditions
Available in matched sets for higher current applications