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Wakefield Thermal Solutions

Wakefield-Vette, now known as simply Wakefield, is a company specializing in thermal management solutions for electronics and electrical systems. They provide a range of products designed to dissipate heat effectively and efficiently, ensuring the optimal performance and reliability of electronic devices. Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.

Wakefield Engineering merged with Vette Corp. in 2009 to form Wakefield-Vette, combining their expertise in thermal management solutions. Wakefield Thermal Solutions provides extruded aluminum extrusions for board level through single and multiple stud and press pack power semiconductors heatsinks. Wakefield is ISO 9001:2000 certified and excels in offering competitively priced thermal solutions for most industries, such as stamped and extruded board level heat sinks, BGA heat sinks, extruded heat sinks for high-powered semiconductors, DC-DC converter heat sinks, bonded fin heat sinks, and many accessory products for heat sinks.

Wakefield provides a variety of natural convection forced air and custom bonded fin extrusions. A complete line of cold plates for liquid cooling is also available. Wakefield offers a comprehensive line of press pack power semiconductor clamps as well as a variety of thermal compounds.

Technologies and Innovations:

• Advanced Materials: Wakefield uses materials such as aluminum, copper, and various alloys to create heat sinks and thermal solutions with optimal thermal conductivity.

• Phase Change Materials: They offer thermal pads and materials that change phase (from solid to liquid) to efficiently transfer heat.

• Liquid Cooling Systems: Wakefield's liquid cooling solutions provide effective cooling for high-power electronics and dense electronic assemblies.

Products and Solutions:

• Heat Sinks: Wakefield produces a variety of heat sinks in different shapes, sizes, and materials. These are used to dissipate heat away from electronic components.

• Thermal Interface Materials (TIMs): They offer TIMs such as thermal greases, pads, and tapes that improve heat transfer between components and heat sinks.

• Liquid Cooling Systems: Wakefield provides liquid cooling solutions for high-power electronic applications, such as cold plates and liquid cooling loops.

• Air Cooling Solutions: They offer fans, fan trays, and other air cooling products to keep electronics within safe operating temperatures.

• Thermal Extrusions: Wakefield manufactures thermal extrusions for custom heat sink designs tailored to specific applications.

• Engineering Services: The company provides engineering services to assist customers in designing and optimizing thermal management solutions for their systems.

Featured Product Lines

• Standard and Custom Aluminum Extrusions
• Bonded Fin Heat Sinks
• Folded Fin, Stack Fin, and Swage Fin Heat Sinks
• Board level Heat Sinks
• Power Semiconductor Clamps
• Cold Plates
• Thermal Greases and Thermal Transformer Products

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