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Zymet Zymet, Inc. is known for manufacturing and supplying adhesives and materials used in the electronics industry. They provide products like adhesives, encapsulants, and underfills used in semiconductor packaging, electronic assembly, and other applications. Zymet's materials enhance the performance and reliability of electronic components.

Zymet is a company that specializes in providing innovative materials and solutions for the electronics industry. With a focus on advanced adhesives, encapsulants, and underfills, Zymet offers a range of products designed to meet the evolving needs of electronic assembly and packaging.

Zymet's adhesive products are used for bonding and attaching various electronic components, including semiconductors, integrated circuits (ICs), connectors, and passive components. These adhesives are formulated to provide strong and reliable bonds, ensuring the integrity and long-term performance of electronic devices.

Zymet AdhesivesEncapsulants offered by Zymet are designed to protect electronic components from environmental factors such as moisture, chemicals, and temperature fluctuations. These materials help to enhance the reliability and durability of electronic assemblies, particularly in demanding applications such as automotive, aerospace, and industrial electronics.

Underfills provided by Zymet are used in flip-chip and other advanced packaging techniques to enhance the mechanical strength and thermal performance of semiconductor devices. These underfills fill the gap between the semiconductor chip and the substrate, minimizing stresses and improving the overall reliability of the assembly.

Zymet's products are developed through extensive research and development efforts, with a focus on providing high-performance solutions to meet the stringent requirements of the electronics industry. The company works closely with customers to understand their specific needs and challenges, offering customized formulations and technical support to ensure successful application and performance.

In addition to its product portfolio, Zymet also offers services such as process development, reliability testing, and technical training to assist customers in optimizing their electronic assembly processes and achieving the desired performance and reliability of their products.

Overall, Zymet is a trusted provider of advanced materials for the electronics industry, offering a range of adhesives, encapsulants, and underfills that contribute to the performance, reliability, and longevity of electronic devices. With their focus on innovation, quality, and customer support, Zymet continues to be a valuable partner for companies in the electronics manufacturing sector.

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants. Through its worldwide network of sales agents and stocking facilities, it serves customers in North and South America, Europe, and Asia. Zymet counts amongst its customers world-class multinational companies that are leaders in their industries. Customers include manufacturers of handheld and consumer electronics, computers, storage devices, automotive electronics, medical electronics, and military electronics.

Zymet Adhesives: Zymet’s thermally conductive silicone and epoxy adhesives excel in two key areas: enhancing thermal management and eliminating the need for space-consuming mechanical fasteners. These adhesives create a strong bond, securely attaching components to heat sinks. Zymet thermal adhesives offer superior cost-efficiency and performance.

Zymet Encapsulants: Board-level encapsulation is crucial for protecting circuit board chips in various electronic devices. Encapsulation of wire-bonded chips on PCBs safeguards sensitive connections from stress, corrosion, and moisture. Zymet's board-level encapsulants provide excellent temperature stability, thermal shock resistance, electrical insulation at both room and elevated temperatures, minimal shrinkage during curing, low stress, and superior chemical resistance.